View TPA3123D2_3407599.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

features applications description TPA3123D2 slos541a ? july 2007 ? revised august 2007 25-w stereo class-d audio power amplifier televisions 25-w/ch into a 4- w load from a 27-v supply 20-w/ch into a 4- w load from a 24-v supply operates from 10 v to 30 v the TPA3123D2 is a 25-w (per channel) efficient, efficient class-d operation eliminates need class-d audio power amplifier for driving stereo for heat sinks speakers in a single-ended configuration or a mono four selectable, fixed-gain settings bridge-tied speaker. the TPA3123D2 can drive internal oscillator (no external components stereo speakers as low as 4 w . the efficiency of the TPA3123D2 eliminates the need for an external heat required) sink when playing music. single-ended analog inputs the gain of the amplifier is controlled by two gain thermal and short-circuit protection with select pins. the gain selections are 20, 26, 32, auto recovery 36 db. space-saving surface-mount 24-pin tssop the patented start-up and shut-down sequences package minimize pop noise in the speakers without pin-to-pin compatible with tpa3120d2 additional circuitry. advanced power-off pop reduction please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. system two, audio precision are trademarks of audio precision, inc. production data information is current as of publication date. copyright ? 2007, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. www.ti.com 1 f m sd mute control pvccl TPA3123D2 tpa3120d2 simplified application circuit pvccr vclamp gain1 bypass 1 f m 1 f m 0.22 f m agnd left channel right channel 10 v to 30 v 10 v to 30 v } 4-step gain control shutdown control linrin bsr bsl pgndr pgndl 0.22 f m 22 h m 22 h m 0.68 f m 470 f m 0.68 f m 1 f m 470 f m gain0 avcc mute rout lout
TPA3123D2 slos541a ? july 2007 ? revised august 2007 these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. pwp (tssop) package (top view) table 1. terminal functions terminal i/o/p description 24-pin name (pwp) shutdown signal for ic (low = disabled, high = operational). ttl logic levels with compliance to sd 2 i avcc rin 6 i audio input for right channel lin 5 i audio input for left channel gain0 18 i gain select least-significant bit. ttl logic levels with compliance to avcc gain1 17 i gain select most-significant bit. ttl logic levels with compliance to avcc mute signal for quick disable/enable of outputs (high = outputs switch at 50% duty cycle, low = mute 4 i outputs enabled). ttl logic levels with compliance to avcc bsl 21 i/o bootstrap i/o for left channel pvccl 1, 3 p power supply for left-channel h-bridge, not internally connected to pvccr or avcc lout 22 o class-d 1/2-h-bridge positive output for left channel pgndl 23, 24 p power ground for left-channel h-bridge vclamp 11 p internally generated voltage supply for bootstrap capacitors bsr 16 i/o bootstrap i/o for right channel rout 15 o class-d 1/2-h-bridge negative output for right channel pgndr 13, 14 p power ground for right-channel h-bridge. pvccr 10, 12 p power supply for right-channel h-bridge, not connected to pvccl or avcc agnd 9 p analog ground for digital/analog cells in core agnd 8 p analog ground for analog cells in core reference for preamplifier inputs. nominally equal to avcc/8. also controls start-up time via bypass 7 o external capacitor sizing. avcc 19, 20 p high-voltage analog power supply. not internally connected to pvccr or pvccl connect to ground. thermal pad should be soldered down on all applications to properly thermal pad die pad p secure device to printed wiring board. 2 submit documentation feedback 12 3 4 5 6 7 8 9 10 11 12 2423 22 21 20 19 18 17 16 15 14 13 pvccl sd pvccl mute lin rin bypass agndagnd pvccr vclamp pvccr pgndlpgndl lout bsl avcc avcc gain0 gain1 bsr rout pgndr pgndr www.ti.com
absolute maximum ratings dissipation ratings recommended operating conditions TPA3123D2 slos541a ? july 2007 ? revised august 2007 over operating free-air temperature range (unless otherwise noted) (1) value unit v cc supply voltage avcc, pvcc ?0.3 to 36 v v i logic input voltage sd, mute, gain0, gain1 ?0.3 to v cc + 0.3 v v in analog input voltage rin, lin ?0.3 to 7 v continuous total power dissipation see dissipation ratings table t a operating free-air temperature range ?40 to 85 c t j operating junction temperature range ?40 to 150 c t stg storage temperature range ?65 to 150 c r l load resistance (minimum value) 3.2 w human-body model (all pins) 2 kv esd electrostatic discharge charged-device model (all pins) 500 v (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. package (1) (2) t a 25 c derating factor t a = 70 c t a = 85 c 24-pin tssop 4.16 w 33.3 mw/ c 2.67 w 2.16 w (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti website at www.ti.com . (2) the thermal pad must be soldered to a thermal land on the printed-circuit board. see the powerpad thermally enhanced package application note (slma002 ). min max unit v cc supply voltage pvcc, avcc 10 30 v v ih high-level input voltage sd, mute, gain0, gain1 2 v v il low-level input voltage sd, mute, gain0, gain1 0.8 v sd, v i = v cc , v cc = 30 v 125 i ih high-level input current mute, v i = v cc , v cc = 30 v 125 a gain0, gain1, v i = v cc , v cc = 24 v 125 sd, v i = 0, v cc = 30 v 1 i il low-level input current mute, v i = 0 v, v cc = 30 v 1 a gain0, gain1, v i = 0 v, v cc = 24 v 1 t a operating free-air temperature ?40 85 c 3 submit documentation feedback www.ti.com
dc characteristics ac characteristics TPA3123D2 slos541a ? july 2007 ? revised august 2007 t a = 25 c, v cc = 24 v, r l = 4 w (unless otherwise noted) parameter test conditions min typ max unit class-d output offset voltage | v os | (measured differentially in btl mode as shown in v i = 0 v, a v = 36 db 7.5 50 mv figure 30 ) v (bypass) avcc/ bypass output voltage no load v 8 i cc(q) sd = 2 v, mute = 0 v, no quiescent supply current 23 37 ma load i cc(q) quiescent supply current in mute mode mute = 0.8 v, no load 23 ma i cc(q) quiescent supply current in shutdown mode sd = 0.8 v , no load 0.39 1 ma r ds(on) drain-source on-state resistance 200 m w gain0 = 0.8 v 18 20 22 gain1 = 0.8 v gain0 = 2 v 24 26 28 g gain db gain0 = 0.8 v 30 32 34 gain = 2 v gain0 = 2 v 34 36 38 mute attenuation v i = 1 vrms ?82 db t a = 25 c, v cc = 24 v, r l = 4 w (unless otherwise noted) parameter test conditions min typ max unit v cc = 24, v ripple = 200 mv pp 100 hz ?48 ksvr supply ripple rejection db gain = 20 db 1 khz ?52 v cc = 24 v, r l = 4 w , f = 1 khz 16 output power at 1% thd+n v cc = 24 v, r l = 8 w , f = 1 khz 8 p o w v cc = 24 v, r l = 4 w , f = 1 khz 20 output power at 10% thd+n v cc = 24 v, r l = 8 w , f = 1 khz 10 r l = 4 w , f = 1 khz, p o = 10 w 0.08% thd+n total harmonic distortion + noise r l = 8 w , f = 1 khz, p o = 5 w 0.08% 85 v v n output integrated noise floor 20 hz to 22 khz, a-weighted filter, gain = 20 db ?80 dbv crosstalk p o = 1 w, f = 1 khz; gain = 20 db ?60 db max output at thd+n < 1%, f = 1 khz, snr signal-to-noise ratio 99 db gain = 20 db thermal trip point 150 c thermal hysteresis 30 c f osc oscillator frequency 230 250 270 khz time from mute input switches high until outputs mute delay 120 msec muted t time from mute input switches low until outputs unmute delay 120 msec unmuted 4 submit documentation feedback www.ti.com
TPA3123D2 slos541a ? july 2007 ? revised august 2007 functional block diagram 5 submit documentation feedback ls hs ls hs osc/ramp mute control bypass av control control bias thermal sc detect sc detect avdd avcc lin rin mute bypass gain1 gain0 sd bsl pvccl lout pgndl vclamp bsr pvccr rout pgndr vclamp vclamp avdd avdd avdd/2 avdd avdd avdd/2 regulator agnd + - + - www.ti.com
typical characteristics TPA3123D2 slos541a ? july 2007 ? revised august 2007 all tests are made at frequency = 1 khz unless otherwise noted. total harmonic distortion + noise total harmonic distortion + noise vs vs frequency frequency figure 1. figure 2. total harmonic distortion + noise total harmonic distortion + noise vs vs frequency output power figure 3. figure 4. 6 submit documentation feedback f ? frequency ? hz 20 100 1k 10k thd+n t otal harmonic distortion + noise % - - 0.1 10 20k 1 0.01 v = 24 v r = 8 (se) gain = 20 db c c l w p = 1 w o p = 2.5 w o p = 5 w o f ? frequency ? hz 20 100 1k 10k thd+n t otal harmonic distortion + noise % - - 0.1 10 20k 1 0.01 v = 24 v r = 4 (se) gain = 20 db c c l w p = 10 w o p = 1 w o p = 5 w o f ? frequency ? hz 20 100 1k 10k thd+n t otal harmonic distortion + noise % - - 0.1 10 20k 1 0.01 v = 18 v r = 4 (se) gain = 20 db c c l w p = 5 w o p = 2.5 w o p = 1 w o www.ti.com p ? output power ? w o 10 m 100 m 1 10 thd+n t otal harmonic distortion + noise % - - 1 40 10 0.01 0.1 v = 12 v c c v = 24 v c c v = 18 v c c r = 4 (se) gain = 20 db l w
TPA3123D2 slos541a ? july 2007 ? revised august 2007 typical characteristics (continued) all tests are made at frequency = 1 khz unless otherwise noted. total harmonic distortion + noise crosstalk vs vs output power frequency figure 5. figure 6. crosstalk gain/phase vs vs frequency frequency figure 7. figure 8. 7 submit documentation feedback www.ti.com -300 200-200 -100 0 100 0 20 5 10 15 20 100k 100 200 1k 2k 10k 20k f ? frequency ? hz gain db - phase - o gain phase v = 24 v r = 4 (se) gain = 20 db l = 33 h c = 1 f c = 470 f c c l fi l t fi l t d c w m m m -100 20 100 1 k 20k f ? frequency ? hz 10k -90 -80 -70 -60 -50 -40 -30 -20 -10 0 crosstalk db - l to r r to l v = 18 v , v = 1 v , r = 8 , gain = 20 db c c o l w -100 20 100 1 k 20k f ? frequency ? hz crosstalk db - 10k -90 -80 -70 -60 -50 -40 -30 -20 -10 0 r to l l to r v = 18 v v = 1 v rms r = 4 (se) gain = 20 db c c o l w thd+n - total harmonic distortion + noise - % p ? output power ? w o r = 8 (se) gain = 20 db l w 1 10 0.01 0.1 10 m 100 m 1 10 40 v = 12 v c c v = 24 v c c v = 18 v c c
TPA3123D2 slos541a ? july 2007 ? revised august 2007 typical characteristics (continued) all tests are made at frequency = 1 khz unless otherwise noted. gain/phase output power vs vs frequency supply voltage figure 9. a. dashed line represents thermally limited region. figure 10. output power efficiency vs vs supply voltage output power figure 11. figure 12. 8 submit documentation feedback www.ti.com -250 200-200 -150 -100 -50 0 50 100 150 5 22.5 7.5 10 12.5 15 17.5 20 20 100k 100 200 1k 2k 10k 20k f ? frequency ? hz gain db - phase - o gain phase v = 24 v r = 8 (se) gain = 20 db l = 47 h c = 0.22 f c = 470 f c c l fi l t fi l t d c w m m m v ? supply v oltage ? v ss 16 26 p output power w o - - 22 30 28 4 32 12 thd = 10% thd = 1% r = 4 (se) gain = 20 db l w 6 8 2 14 18 10 16 20 24 30 26 12 10 14 18 20 22 24 28 thd = 10% thd = 1% v - supply voltage - v ss p - output power - w o r = 8 (se) gain = 20 db l w 16 26 30 12 10 7 14 18 20 22 24 28 17 16 15 14 13 12 1 1 10 9 6 1 8 5 4 3 2 p ? output power ? w o 6 16 efficiency % - 80 20 10 100 30 12 v 18 v 24 v r = 4 (se) gain = 20 db l w 0 40 60 20 50 70 90 2 0 4 8 10 12 14 18
TPA3123D2 slos541a ? july 2007 ? revised august 2007 typical characteristics (continued) all tests are made at frequency = 1 khz unless otherwise noted. efficiency supply current vs vs output power output power figure 13. figure 14. supply current power supply rejection ratio vs vs output power frequency figure 15. figure 16. 9 submit documentation feedback www.ti.com p ? output power ? w o i ? supply current ? a c c 12 32 1.6 40 0.2 2 0.6 18 v 0 0.8 1.2 0.4 1 1.4 1.8 4 0 8 16 20 24 28 36 r = 4 (se) gain = 20 db l w 24 v 12 v p ? output power ? w o efficiency % - 80 10 100 30 0 40 60 20 50 70 90 12 0 1 2 3 4 5 6 7 8 9 10 11 r = 8 (se) gain = 20 db l w 12 v 18 v 24 v -120 20 100 1 k 20k f ? frequency ? hz power supply rejection ratio db - 10k -110 -100 -90 -80 -70 -50 0 v = 24 v v = 0.2 v r = 4 (se) gain = 20 db c c o (r i p p l e ) pp l w -40 -30 -20 -10-60 0.90.8 0.7 0.60.5 0.4 0.3 0.2 0.1 0 0 2.5 5 7.5 10 12.5 15 17.5 20 22.5 25 p - output power - w o i - supply current - a cc 12 v 18 v 24 v r = 8 , gain = 20 db l w
TPA3123D2 slos541a ? july 2007 ? revised august 2007 typical characteristics (continued) all tests are made at frequency = 1 khz unless otherwise noted. total harmonic distortion + noise total harmonic distortion + noise vs vs frequency output power figure 17. figure 18. gain/phase output power vs vs frequency supply voltage figure 19. a. dashed line represents thermally limited region. figure 20. 10 submit documentation feedback www.ti.com -200 400-100 0 100 200 300 -30 30 -20 -10 0 10 20 20 200k 100 1k 10k f - frequency - hz phase - gain - db phase gain v = 24 v, r = 8 (btl), gain = 20 db, l = 33 h, c = 1 f cc l filt filt w m m f ? frequency ? hz 20 100 1k 10k thd+n t otal harmonic distortion + noise % - - 0.1 10 20k 1 0.01 0.001 v = 24 v r = 8 (btl) gain = 20 db c c l w p = 20 w o p = 1 w o p = 5 w o r = 8 (btl) gain = 20 db l w p ? output power ? w o 10 m 100 m 1 10 thd+n t otal harmonic distortion + noise % - - 1 40 10 0.01 0.1 v = 12 v c c v = 24 v c c v = 18 v c c v ? supply v oltage ? v ss 16 26 p output power w o - - 40 30 55 0 65 15 thd = 10% thd = 1% r = 8 (btl) gain = 20 db l w 20 30 10 25 35 45 60 50 12 10 14 18 20 22 24 28 5
TPA3123D2 slos541a ? july 2007 ? revised august 2007 typical characteristics (continued) all tests are made at frequency = 1 khz unless otherwise noted. efficiency power supply rejection ratio vs vs output power frequency figure 21. figure 22. 11 submit documentation feedback www.ti.com p ? output power ? w o 32 efficiency % - 80 40 10 100 30 r = 8 (btl) gain = 20 db l w 0 40 60 20 50 70 90 4 0 8 16 20 24 28 36 12 v 18 v 24 v 12 -140 20 100 1 k 20k f ? frequency ? hz power supply rejection ratio db - 10k -120 -100 -80 -60 -40 -20 0 v = 24 v v = 200 mv r = 8 (btl) gain = 20 db c c o (r i p p l e ) l w
application information class-d operation traditional class-d modulation scheme supply pumping TPA3123D2 slos541a ? july 2007 ? revised august 2007 this section focuses on the class-d operation of the TPA3123D2. the TPA3123D2 operates in ad mode. there are two main configurations that may be used. for stereo operation, the TPA3123D2 should be configured in a single-ended (se) half-bridge amplifier. for mono applications, TPA3123D2 may be used as a bridge-tied-load (btl) amplifier. the traditional class-d modulation scheme, which is used in the TPA3123D2 btl configuration, has a differential output where each output is 180 degrees out of phase and changes from ground to the supply voltage, v cc . therefore, the differential prefiltered output varies between positive and negative v cc , where filtered 50% duty cycle yields 0 v across the load. the class-d modulation scheme with voltage and current waveforms is shown in figure 23 and figure 24 . figure 23. class-d modulation for TPA3123D2 se configuration figure 24. class-d modulation for TPA3123D2 btl configuration one issue encountered in single ended (se) class-d amplifier designs is supply pumping. power-supply pumping is a rise in the local supply voltage due to energy being driven back to the supply by operation of the class-d amplifier. this phenomenon is most evident at low audio frequencies and when both channels are operating at the same frequency and phase. at low levels, power supply pumping results in distortion in the audio output due to fluctuations in supply voltage. at higher levels, pumping can cause the overvoltage protection to operate, which temporarily shuts down the audio output. 12 submit documentation feedback www.ti.com output current +v cc 0 v +v cc 0 v +v cc 0 v Cv cc differential voltage across speaker +v cc 0 v output current
gain setting via gain0 and gain1 inputs input resistance (1) TPA3123D2 slos541a ? july 2007 ? revised august 2007 application information (continued) several things can be done to relieve power-supply pumping. the lowest impact is to operate the two inputs out of phase 180 and reverse the speaker connections. because most audio is highly correlated, this causes the supply pumping to be out of phase and not as severe. if this is not enough, the amount of bulk capacitance on the supply must be increased. also, improvement is realized by hooking other supplies to this node which sinks some of the excess current. power supply pumping should be tested by operating the amplifier at low frequencies and high output levels. the gain of the TPA3123D2 is set by two input terminals, gain0 and gain1. the gains listed in table 2 are realized by changing the taps on the input resistors and feedback resistors inside the amplifier. this causes the input impedance (z i ) to be dependent on the gain setting. the actual gain settings are controlled by ratios of resistors, so the gain variation from part-to-part is small. however, the input impedance from part-to-part at the same gain may shift by 20% due to shifts in the actual resistance of the input resistors. for design purposes, the input network (discussed in the next section) should be designed assuming an input impedance of 8 k w , which is the absolute minimum input impedance of the TPA3123D2. at the higher gain settings, the input impedance could increase as high as 72 k w . table 2. gain setting amplifier gain (db), input impedance (k w ), gain1 gain0 typical typical 0 0 20 10 0 1 26 15 1 0 32 30 1 1 36 60 changing the gain setting can vary the input resistance of the amplifier from its smallest value, 10 k w 20%, to the largest value, 60 k w 20%. as a result, if a single capacitor is used in the input high-pass filter, the ?3-db or cutoff frequency may change when changing gain steps. the ?3-db frequency can be calculated using equation 1 . use the z i values given in table 2 . 13 submit documentation feedback www.ti.com f = 1 2 z c p i i c i in z i z f input signal
input capacitor, c i (2) (3) single-ended output capacitor, c o TPA3123D2 slos541a ? july 2007 ? revised august 2007 in the typical application, an input capacitor (c i ) is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. in this case, c i and the input impedance of the amplifier (z i ) form a high-pass filter with the corner frequency determined in equation 2 . the value of c i is important, as it directly affects the bass (low-frequency) performance of the circuit. consider the example where z i is 20 k w and the specification calls for a flat bass response down to 20 hz. equation 2 is reconfigured as equation 3 . in this example, c i is 0.4 f; so, one would likely choose a value of 0.47 f as this value is commonly used. if the gain is known and is constant, use z i from table 2 to calculate c i . a further consideration for this capacitor is the leakage path from the input source through the input network (c i ) and the feedback network to the load. this leakage current creates a dc offset voltage at the input to the amplifier that reduces useful headroom, especially in high-gain applications. for this reason, a low-leakage tantalum or ceramic capacitor is the best choice. when polarized capacitors are used, the positive side of the capacitor should face the amplifier input in most applications as the dc level there is held at v byp (v cc /8), which is likely higher than the source dc level. note that it is important to confirm the capacitor polarity in the application. additionally, lead-free solder can create dc offset voltages, and it is important to ensure that boards are cleaned properly. in single ended (se) applications, the dc blocking capacitor forms a high-pass filter with the speaker impedance. the frequency response rolls of with decreasing frequency at a rate of 20 db/decade. the cutoff frequency is determined by: fc = 1/2 c o z l table 3 shows some common component values and the associated cutoff frequencies: table 3. common filter responses c se ? dc blocking capacitor ( f) speaker impedance ( w ) f c = 60 hz (?3 db) f c = 40 hz (?3 db) f c = 20 hz (?3 db) 4 680 1000 2200 8 330 470 1000 14 submit documentation feedback www.ti.com c = i 1 2 z f p i c f = c 1 2 z c p i i C3 db f c
output filter and frequency response power-supply decoupling, c s bsn and bsp capacitors TPA3123D2 slos541a ? july 2007 ? revised august 2007 for the best frequency response, a flat-passband output filter (second-order butterworth) may be used. the output filter components consist of the series inductor and capacitor to ground at the lout and rout pins. there are several possible configurations depending on the speaker impedance, and whether the output configuration is single ended (se) or bridge-tied load (btl). table 4 lists the recommended values for the filter components. it is important to use a high-quality capacitor in this application. a rating of at least x7r is required. table 4. recommended filter output components output configuration speaker impedance ( w ) filter inductor ( h) filter capacitor (nf) 4 22 680 single ended (se) 8 47 390 4 10 1500 bridge tied load (btl) 8 22 680 figure 25. btl filter configuration figure 26. se filter configuration the TPA3123D2 is a high-performance cmos audio amplifier that requires adequate power-supply decoupling to ensure that the output total harmonic distortion (thd) is as low as possible. power-supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker. the optimum decoupling is achieved by using two capacitors of different types that target different types of noise on the power-supply leads. for higher-frequency transients, spikes, or digital hash on the line, a good low equivalent-series-resistance (esr) ceramic capacitor, typically 0.1 f to 1 f, placed as close as possible to the device v cc lead works best. for filtering lower frequency noise signals, a larger aluminum electrolytic capacitor of 470 f or greater placed near the audio power amplifier is recommended. the 470- f capacitor also serves as local storage capacitor for supplying current during large signal transients on the amplifier outputs. the pvcc terminals provide the power to the output transistors, so a 470-f or larger capacitor should be placed on each pvcc terminal. a 10-f capacitor on the avcc terminal is adequate. these capacitors must be properly derated for voltage and ripple current rating to ensure reliability. the half h-bridge output stages use only nmos transistors. therefore, they require bootstrap capacitors for the high side of each output to turn on correctly. a 220-nf ceramic capacitor, rated for at least 25 v, must be connected from each output to its corresponding bootstrap input. specifically, one 220-nf capacitor must be connected from lout to bsl, and one 220-nf capacitor must be connected from rout to bsr. the bootstrap capacitors connected between the bsx pins and their corresponding outputs function as a floating power supply for the high-side n-channel power mosfet gate-drive circuitry. during each high-side switching cycle, the bootstrap capacitors hold the gate-to-source voltage high enough to keep the high-side mosfets turned on. 15 submit documentation feedback www.ti.com lout / rout l filter c filter lout l filter c filter l filter c filter rout
vclamp capacitor vbyp capacitor selection shutdown operation mute operation using low-esr capacitors short-circuit protection TPA3123D2 slos541a ? july 2007 ? revised august 2007 to ensure that the maximum gate-to-source voltage for the nmos output transistors is not exceeded, one internal regulator clamps the gate voltage. one 1- f capacitor must be connected from vclamp (pin 11) to ground and must be rated for at least 16 v. the voltages at the vclamp terminal may vary with v cc and may not be used for powering any other circuitry. the scaled supply reference (vbyp) nominally provides an avcc/8 internal bias for the preamplifier stages. the external capacitor for this reference (c byp ) is a critical component and serves several important functions. during start-up or recovery from shutdown mode, c byp determines the rate at which the amplifier starts. the start up time is proportional to 0.5 s per microfarad. thus, the recommended 1- f capacitor results in a start-up time of approximately 500 ms. the second function is to reduce noise produced by the power supply caused by coupling with the output drive signal. this noise could result in degraded power supply-rejection and thd+n. the circuit is designed for a c byp value of 1 f for best pop performance. the inputs capacitors should have the same value. a ceramic or tantalum low-esr capacitor is recommended. the TPA3123D2 employs a shutdown mode of operation designed to reduce supply current (i cc ) to the absolute minimum level during periods of nonuse for power conservation. the shutdown input terminal should be held high (see specification table for trip point) during normal operation when the amplifier is in use. pulling shutdown low causes the outputs to mute and the amplifier to enter a low-current state. never leave shutdown unconnected, because amplifier operation would be unpredictable. for the best power-up pop performance, place the amplifier in the shutdown or mute mode prior to applying the power-supply voltage. the mute pin is an input for controlling the output state of the TPA3123D2. a logic high on this terminal causes the outputs to run at a constant 50% duty cycle. a logic low on this pin enables the outputs. this terminal may be used as a quick disable/enable of outputs when changing channels on a television or transitioning between different audio sources. the mute terminal should never be left floating. for power conservation, the shutdown terminal should be used to reduce the quiescent current to the absolute minimum level. low-esr capacitors are recommended throughout this application section. a real (as opposed to ideal) capacitor can be modeled simply as a resistor in series with an ideal capacitor. the voltage drop across this resistor minimizes the beneficial effects of the capacitor in the circuit. the lower the equivalent value of this resistance, the more the real capacitor behaves like an ideal capacitor. the TPA3123D2 has short-circuit protection circuitry on the outputs that prevents damage to the device during output-to-output shorts and output-to-gnd shorts after the filter and output capacitor (at the speaker terminal.) directly at the device terminals, the protection circuitry prevents damage to device during output-to-output, output-to-ground, and output-to-supply. when a short circuit is detected on the outputs, the part immediately disables the output drive. this is an unlatched fault. normal operation is restored when the fault is removed. 16 submit documentation feedback www.ti.com
thermal protection printed-circuit board (pcb) layout TPA3123D2 slos541a ? july 2007 ? revised august 2007 thermal protection on the TPA3123D2 prevents damage to the device when the internal die temperature exceeds 150 c. there is a 15 c tolerance on this trip point from device to device. once the die temperature exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. this is not a latched fault. the thermal fault is cleared once the temperature of the die is reduced by 30 c. the device begins normal operation at this point with no external system interaction. because the TPA3123D2 is a class-d amplifier that switches at a high frequency, the layout of the printed-circuit board (pcb) should be optimized according to the following guidelines for the best possible performance. decoupling capacitors?the high-frequency 0.1-f decoupling capacitors should be placed as close to the pvcc (pins 1, 3, 10, and 12) and avcc (pins 19 and 20) terminals as possible. the vbyp (pin 7) capacitor and vclamp (pin 11) capacitor should also be placed as close to the device as possible. large (220-f or greater) bulk power-supply decoupling capacitors should be placed near the TPA3123D2 on the pvccl and pvccr terminals. grounding?the avcc (pins 19 and 20) decoupling capacitor and vbyp (pin 7) capacitor should each be grounded to analog ground (agnd, pins 8 and 9). the pvccx decoupling capacitors and vclamp capacitors should each be grounded to power ground (pgnd, pins 13, 14, 23, and 24). analog ground and power ground should be connected at the thermal pad, which should be used as a central ground connection or star ground for the TPA3123D2. output filter?the reconstruction filter (l1, l2, c9, and c16) should be placed as close to the output terminals as possible for the best emi performance. the capacitors should be grounded to power ground. thermal pad?the thermal pad must be soldered to the pcb for proper thermal performance and optimal reliability. the dimensions of the thermal pad and thermal land are described in the mechanical section at the back of the data sheet. see ti technical briefs slma002 and sloa120 for more information about using the thermal pad. for recommended pcb footprints, see figures at the end of this data sheet. for an example layout, see the TPA3123D2 evaluation module (TPA3123D2evm) user manual, (slou189 ). both the evm user manual and the thermal pad application note are available on the ti web site at http://www.ti.com . 17 submit documentation feedback www.ti.com
TPA3123D2 slos541a ? july 2007 ? revised august 2007 figure 27. schematic for single ended (se) configuration figure 28. schematic for bridge tied (btl) configuration 18 submit documentation feedback www.ti.com vcc vcc left in shutdown control mute control right in 10 f m 22 h m 470 f m 0.68 f m TPA3123D2 pvccl 1 sd 2 pvccl 3 mute 4 lin 5 rin 6 bypass 7 agnd 8 agnd 9 pvccr 10 vclamp 11 pvccr 12 pgndr 13 pgndr 14 rout 15 bsr 16 gain1 17 gain0 18 avcc 19 avcc 20 bsl 21 lout 22 pgndl 23 pgndl 24 thermal 25 1.0 f m +lout 0.22 f m -rout -lout +rout 0.1 f m 1.0 f m 470 470 470 f f f m m m 1.0 f m 1.0 f m 1.0 f m 1.0 f m 0.22 f m 22 h m 0.68 f m + in- in +out +out-out -out vcc vcc shutdown control mute control 10 f m 22 h m 470 f m 0.68 f m TPA3123D2 pvccl 1 sd 2 pvccl 3 mute 4 lin 5 rin 6 bypass 7 agnd 8 agnd 9 pvccr 10 vclamp 11 pvccr 12 pgndr 13 pgndr 14 rout 15 bsr 16 gain1 17 gain0 18 avcc 19 avcc 20 bsl 21 lout 22 pgndl 23 pgndl 24 thermal 25 1.0 f m 0.22 f m 0.1 f m 1.0 f m 470 f m 1.0 f m 1.0 f m 1.0 f m 1.0 f m 0.22 f m 22 h m 0.68 f m
basic measurement system TPA3123D2 slos541a ? july 2007 ? revised august 2007 this application note focuses on methods that use the basic equipment listed below: audio analyzer or spectrum analyzer digital multimeter (dmm) oscilloscope twisted-pair wires signal generator power resistor(s) linear regulated power supply filter components evm or other complete audio circuit figure 29 shows the block diagrams of basic measurement systems for class-ab and class-d amplifiers. a sine wave is normally used as the input signal because it consists of the fundamental frequency only (no other harmonics are present). an analyzer is then connected to the audio power amplifier (apa) output to measure the voltage output. the analyzer must be capable of measuring the entire audio bandwidth. a regulated dc power supply is used to reduce the noise and distortion injected into the apa through the power pins. a system two? audio measurement system (ap-ii) by audio precision? includes the signal generator and analyzer in one package. the generator output and amplifier input must be ac-coupled. however, the evms already have the ac-coupling capacitors, (c in ), so no additional coupling is required. the generator output impedance should be low to avoid attenuating the test signal, and is important because the input resistance of apas is not high. conversely, the analyzer input impedance should be high. the output resistance, r out , of the apa is normally in the hundreds of milliohms and can be ignored for all but the power-related calculations. figure 29 (a) shows a class-ab amplifier system. it takes an analog signal input and produces an analog signal output. this amplifier circuit can be directly connected to the ap-ii or other analyzer input. this is not true of the class-d amplifier system shown in figure 29 (b), which requires low-pass filters in most cases in order to measure the audio output waveforms. this is because it takes an analog input signal and converts it into a pulse-width modulated (pwm) output signal that is not accurately processed by some analyzers. 19 submit documentation feedback www.ti.com
TPA3123D2 slos541a ? july 2007 ? revised august 2007 figure 29. audio measurement systems 20 submit documentation feedback www.ti.com analyzer 20 hz - 20 khz (a) basic class-ab apa signal generator power supply analyzer 20 hz - 20 khz r l (b) traditional class-d class-d apa signal generator power supply r l l filt c filt
se input and se output (TPA3123D2 stereo configuration) TPA3123D2 slos541a ? july 2007 ? revised august 2007 the se input and output configuration is used with class-ab amplifiers. a block diagram of a fully se measurement circuit is shown in figure 30 . se inputs normally have one input pin per channel. in some cases, two pins are present; one is the signal and the other is ground. se outputs have one pin driving a load through an output ac-coupling capacitor and the other end of the load is tied to ground. se inputs and outputs are considered to be unbalanced, meaning one end is tied to ground and the other to an amplifier input/output. the generator should have unbalanced outputs, and the signal should be referenced to the generator ground for best results. unbalanced or balanced outputs can be used when floating, but they may create a ground loop that affects the measurement accuracy. the analyzer should have balanced inputs to cancel out any common-mode noise in the measurement. figure 30. se input?se output measurement circuit the following general rules should be followed when connecting to apas with se inputs and outputs: use an unbalanced source to supply the input signal. use an analyzer with balanced inputs. use twisted-pair wire for all connections. use shielding when the system environment is noisy. ensure the cables from the power supply to the apa, and from the apa to the load, can handle the large currents (see table 5 ). 21 submit documentation feedback www.ti.com v gen c in c l r in r gen twisted-pair wire generator evaluation module audio power amplifier twisted-pair wire r l r ana c ana analyzer r ana c ana l filt c filt
differential input and btl output (TPA3123D2 mono configuration) TPA3123D2 slos541a ? july 2007 ? revised august 2007 many of the class-d apas and many class-ab apas have differential inputs and bridge-tied-load (btl) outputs. differential inputs have two input pins per channel and amplify the difference in voltage between the pins. differential inputs reduce the common-mode noise and distortion of the input circuit. btl is a term commonly used in audio to describe differential outputs. btl outputs have two output pins providing voltages that are 180 out of phase. the load is connected between these pins. this has the added benefits of quadrupling the output power to the load and eliminating a dc-blocking capacitor. a block diagram of the measurement circuit is shown in figure 31 . the differential input is a balanced input, meaning the positive (+) and negative (?) pins have the same impedance to ground. similarly, the se output equates to a balanced output. figure 31. differential input, btl output measurement circuit the generator should have balanced outputs, and the signal should be balanced for best results. an unbalanced output can be used, but it may create a ground loop that affects the measurement accuracy. the analyzer must also have balanced inputs for the system to be fully balanced, thereby cancelling out any common-mode noise in the circuit and providing the most accurate measurement. the following general rules should be followed when connecting to apas with differential inputs and btl outputs: use a balanced source to supply the input signal. use an analyzer with balanced inputs. use twisted-pair wire for all connections. use shielding when the system environment is noisy. ensure that the cables from the power supply to the apa, and from the apa to the load, can handle the large currents (see table 5 ). table 5 shows the recommended wire size for the power supply and load cables of the apa system. the real concern is the dc or ac power loss that occurs as the current flows through the cable. these recommendations are based on 12-inch (30.5-cm)-long wire with a 20-khz sine-wave signal at 25 c. table 5. recommended minimum wire size for power cables dc power loss ac power loss p out (w) r l ( w ) awg size (mw) (mw) 10 4 18 22 16 40 18 42 2 4 18 22 3.2 8 3.7 8.5 1 8 22 28 2 8 2.1 8.1 < 0.75 8 22 28 1.5 6.1 1.6 6.2 22 submit documentation feedback www.ti.com c in audio power amplifier generator c in r gen r gen r in r in v gen analyzer r ana r ana c ana r l c ana twisted-pair wire evaluation module twisted-pair wire l filt l filt c filt c filt
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) TPA3123D2pwp active htssop pwp 24 60 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr TPA3123D2pwpr active htssop pwp 24 2000 green (rohs & no sb/br) cu nipdau level-3-260c-168 hr (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 7-aug-2007 addendum-page 1
tape and reel information package materials information www.ti.com 4-aug-2007 pack materials-page 1
device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TPA3123D2pwpr pwp 24 tai 330 16 6.95 8.3 1.6 8 16 q1 tape and reel box information device package pins site length (mm) width (mm) height (mm) TPA3123D2pwpr pwp 24 tai 346.0 346.0 33.0 package materials information www.ti.com 4-aug-2007 pack materials-page 2

important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com telephony www.ti.com/telephony low power www.ti.com/lpw video & imaging www.ti.com/video wireless wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2007, texas instruments incorporated

▲Up To Search▲

Price & Availability of TPA3123D2

	To Download TPA3123D2 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .